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Please use this identifier to cite or link to this item: http://hdl.handle.net/2289/2240

Title: Fine grain growth of nickel electrodeposit: effect of applied magnetic field during deposition
Authors: Ganesh, V.
Vijayaraghavan, D.
Lakshminarayanan, V.
Keywords: Convective flow
Magnetoelectrolysis
Magnetohydrodynamic effect
Nanoparticles
Overpotenial
Roughness factor
Issue Date: 15-Feb-2005
Publisher: Elsevier B.V.
Citation: Applied Surface Science , 2005, Vol.240, p286-295
Abstract: The electrodeposition of nickel from a nickel sulphamate bath in the presence of a magnetic field applied at an angle of 45° to the cathode surface produces a nickel deposit with a fine grain structure. The sizes of grains vary from not, vert, similar17 to 25 nm. We have used scanning electron microscopy (SEM), scanning tunneling microscopy (STM) and X-ray diffraction (XRD) to characterize the surface morphology of the deposit. The SEM pictures show the formation of domain growth of nickel in which the nickel nanoparticles are mostly concentrated at domain boundaries while STM and XRD analysis show the existence of individual nanoparticles. From the chronopotentiometry studies during magnetoelectrolysis of nickel, we find a significant lowering of overpotential with time and large negative shift in electrode potential in the presence of a magnetic field. We believe from these results that magnetic field induced convection increases the mass transfer rate, reduces the concentration polarisation and leads to the growth of fine grain deposit. The large shift in electrode potential on the application of magnetic field is attributed to the field-induced shift in chemical potential of the ferromagnetic nickel electrode. We have used cyclic voltammetry (CV) to determine the roughness factor and steady state current-potential plots to study the hydrogen evolution reaction on the nickel-electrodeposited surface.
Description: Restricted Access.
URI: http://hdl.handle.net/2289/2240
ISSN: 0169-4332
Alternative Location: http://dx.doi.org/10.1016/j.apsusc.2004.06.139
Copyright: 2005 Elsevier B. V.
Appears in Collections:Research Papers (SCM)

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